To enhance semiconductor efficiency. it is imperative to develop a die-bonding material possessing exceptional thermal conductivity and stress-shielding capabilities to safeguard semiconductor components from detrimental heat and destructive stress. In this study. we employed a multi-objective topology optimization approach to design a porous microstructure for the die-bonding layer o... https://www.ealisboa.com/top-save-RE-DESIGNED-Strikketoy-oppbevaring-Prosjekt-27-Sort-100-Skinn-great-save/